Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030761 | Mold design and semiconductor package | Ravi Kanth Kolan, Hao Liu | 2011-10-04 |
| 7948095 | Semiconductor package and method of making the same | Catherine Bee Liang Ng, Anthony Yi Sheng Sun | 2011-05-24 |