Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030761 | Mold design and semiconductor package | Hao Liu, Chin Hock Toh | 2011-10-04 |
| 7883938 | Stacked die semiconductor package and method of assembly | Anthony Sun-Yi Sheng, Liu Hao, Toh Chin Hock | 2011-02-08 |