TH

Toh Chin Hock

UC United Test And Assembly Center: 1 patents #7 of 16Top 45%
📍 Singapore, SG: #215 of 890 inventorsTop 25%
Overall (2011): #143,173 of 364,097Top 40%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7883938 Stacked die semiconductor package and method of assembly Ravi Kanth Kolan, Anthony Sun-Yi Sheng, Liu Hao 2011-02-08