Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7883938 | Stacked die semiconductor package and method of assembly | Ravi Kanth Kolan, Anthony Sun-Yi Sheng, Toh Chin Hock | 2011-02-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7883938 | Stacked die semiconductor package and method of assembly | Ravi Kanth Kolan, Anthony Sun-Yi Sheng, Toh Chin Hock | 2011-02-08 |