Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053359 | Semiconductor device having a second level of metallization formed over a first level with minimal damage to the first level and method | Syun-Ming Jang | 2011-11-08 |
| 8030781 | Bond pad structure having dummy plugs and/or patterns formed therearound | Chen-Hua Yu | 2011-10-04 |
| 7968451 | Method for forming self-assembled mono-layer liner for Cu/porous low-k interconnections | Chung-Chi Ko, Chia-Cheng Chou, Keng-Chu Lin, Chen-Hua Yu | 2011-06-28 |
| 7964496 | Schemes for forming barrier layers for copper in interconnect structures | Chen-Hua Yu, Hai-Ching Chen | 2011-06-21 |