Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7998873 | Method for fabricating low-k dielectric and Cu interconnect | Chih-Hao Chen, Chia-Cheng Chou, Ming-Chung Liang, Tzu-Li Lee | 2011-08-16 |
| RE42514 | Extreme low-K dielectric film scheme for advanced interconnects | Fang Wen Tsai, Kuan-Chen Wang, Chih-Lung Lin, Shwang-Ming Jeng | 2011-07-05 |
| 7968451 | Method for forming self-assembled mono-layer liner for Cu/porous low-k interconnections | Chung-Chi Ko, Chia-Cheng Chou, Tien-I Bao, Chen-Hua Yu | 2011-06-28 |