Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8043959 | Method of forming a low-k dielectric layer with improved damage resistance and chemical integrity | Keng-Chu Iin, Ming-Ling Yeh | 2011-10-25 |
| 7998873 | Method for fabricating low-k dielectric and Cu interconnect | Chih-Hao Chen, Ming-Chung Liang, Keng-Chu Lin, Tzu-Li Lee | 2011-08-16 |
| 7968451 | Method for forming self-assembled mono-layer liner for Cu/porous low-k interconnections | Chung-Chi Ko, Keng-Chu Lin, Tien-I Bao, Chen-Hua Yu | 2011-06-28 |