Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7968451 | Method for forming self-assembled mono-layer liner for Cu/porous low-k interconnections | Chia-Cheng Chou, Keng-Chu Lin, Tien-I Bao, Chen-Hua Yu | 2011-06-28 |
| 7897505 | Method for enhancing adhesion between layers in BEOL fabrication | Lih-Ping Li, Yung-Cheng Lu, Hui-Lin Chang, Chih-Hsien Lin | 2011-03-01 |