Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053356 | Interconnect structure for semiconductor devices | Hung Chun Tsai, Yung-Cheng Lu, Syun-Ming Jang | 2011-11-08 |
| 7977791 | Selective formation of boron-containing metal cap pre-layer | Yung-Cheng Lu, Syun-Ming Jang | 2011-07-12 |
| 7897505 | Method for enhancing adhesion between layers in BEOL fabrication | Chung-Chi Ko, Lih-Ping Li, Yung-Cheng Lu, Chih-Hsien Lin | 2011-03-01 |