Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053356 | Interconnect structure for semiconductor devices | Hui-Lin Chang, Hung Chun Tsai, Yung-Cheng Lu | 2011-11-08 |
| 8053359 | Semiconductor device having a second level of metallization formed over a first level with minimal damage to the first level and method | Tien-I Bao | 2011-11-08 |
| 7977791 | Selective formation of boron-containing metal cap pre-layer | Hui-Lin Chang, Yung-Cheng Lu | 2011-07-12 |
| 7968506 | Wet cleaning stripping of etch residue after trench and via opening formation in dual damascene process | Chun-Li Chou, Jyu-Horng Shieh, Chih-Yuan Ting | 2011-06-28 |
| 7863196 | Self-aligned dielectric cap | Hulin Chang, Yung-Cheng Lu | 2011-01-04 |