Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7964496 | Schemes for forming barrier layers for copper in interconnect structures | Chen-Hua Yu, Tien-I Bao | 2011-06-21 |
| 7928549 | Integrated circuit devices with multi-dimensional pad structures | Harold C. H. Hsiung, Henry Lo | 2011-04-19 |