Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8069813 | Wafer electroless plating system and associated methods | William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more | 2011-12-06 |
AO
Aleksander Owczarz
Overall (2011): #357,281 of 364,097Top 100%
1
Patents 2011