Issued Patents 2011
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058099 | Method of fabricating a two-sided die in a four-sided leadframe based package | Cheemen Yu, Vani Verma | 2011-11-15 |
| 8053880 | Stacked, interconnected semiconductor package | Cheeman Yu, Chih-Chin Liao | 2011-11-08 |
| 8053276 | Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages | Cheeman Yu, Chi-Chin Liao | 2011-11-08 |
| 8022519 | System-in-a-package based flash memory card | Robert C. Miller, Warren Middlekauff, Michael W. Patterson, Shrikar Bhagath | 2011-09-20 |
| 8022417 | Method of assembling semiconductor devices with LEDS | Suresh Upadhyayula | 2011-09-20 |
| 8008132 | Etched surface mount islands in a leadframe package | Suresh Upadhyayula, Bonnie Ming-Yan Chan, Shih-Ping Fan-chiang | 2011-08-30 |
| 7994647 | Method of reducing memory card edge roughness by edge coating | Ong King Hoo, Java Zhu, Ning Ye | 2011-08-09 |
| 7967184 | Padless substrate for surface mounted components | Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Chin-Tien Chiu, Jack Chang Chien +2 more | 2011-06-28 |
| 7952179 | Semiconductor package having through holes for molding back side of package | Chin-Tien Chiu, Chih-Chin Liao, Cheemen Yu, Ning Ye, Jack Chang Chien | 2011-05-31 |
| 7939944 | Semiconductor die having a redistribution layer | Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Cheeman Yu | 2011-05-10 |
| 7939382 | Method of fabricating a semiconductor package having through holes for molding back side of package | Chin-Tien Chiu, Chih-Chin Liao, Cheemen Yu, Ning Ye, Jack Chang Chien | 2011-05-10 |
| 7867819 | Semiconductor package including flip chip controller at bottom of die stack | Suresh Upadhyayula | 2011-01-11 |
| 7864540 | Peripheral card with sloped edges | — | 2011-01-04 |