Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7967184 | Padless substrate for surface mounted components | Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Jack Chang Chien, Shrikar Bhagath +2 more | 2011-06-28 |
| 7952179 | Semiconductor package having through holes for molding back side of package | Hem Takiar, Chih-Chin Liao, Cheemen Yu, Ning Ye, Jack Chang Chien | 2011-05-31 |
| 7939382 | Method of fabricating a semiconductor package having through holes for molding back side of package | Hem Takiar, Chih-Chin Liao, Cheemen Yu, Ning Ye, Jack Chang Chien | 2011-05-10 |
| 7939944 | Semiconductor die having a redistribution layer | Chien-Ko Liao, Jack Chang Chien, Cheeman Yu, Hem Takiar | 2011-05-10 |