Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053276 | Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages | Chi-Chin Liao, Hem Takiar | 2011-11-08 |
| 8053880 | Stacked, interconnected semiconductor package | Chih-Chin Liao, Hem Takiar | 2011-11-08 |
| 7939944 | Semiconductor die having a redistribution layer | Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Hem Takiar | 2011-05-10 |