CL

Chi-Chin Liao

ST Sandisk Technologies: 1 patents #44 of 135Top 35%
📍 Changhua City, TW: #19 of 66 inventorsTop 30%
Overall (2011): #332,882 of 364,097Top 95%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8053276 Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages Cheeman Yu, Hem Takiar 2011-11-08