Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058099 | Method of fabricating a two-sided die in a four-sided leadframe based package | Vani Verma, Hem Takiar | 2011-11-15 |
| 7967184 | Padless substrate for surface mounted components | Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Chin-Tien Chiu, Jack Chang Chien +2 more | 2011-06-28 |
| 7952179 | Semiconductor package having through holes for molding back side of package | Chin-Tien Chiu, Hem Takiar, Chih-Chin Liao, Ning Ye, Jack Chang Chien | 2011-05-31 |
| 7939382 | Method of fabricating a semiconductor package having through holes for molding back side of package | Chin-Tien Chiu, Hem Takiar, Chih-Chin Liao, Ning Ye, Jack Chang Chien | 2011-05-10 |