Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8022417 | Method of assembling semiconductor devices with LEDS | Hem Takiar | 2011-09-20 |
| 8008132 | Etched surface mount islands in a leadframe package | Bonnie Ming-Yan Chan, Shih-Ping Fan-chiang, Hem Takiar | 2011-08-30 |
| 7867819 | Semiconductor package including flip chip controller at bottom of die stack | Hem Takiar | 2011-01-11 |