Issued Patents 2011
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080880 | Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads | Markus Brunnbauer, Thorsten Meyer | 2011-12-20 |
| 8072071 | Semiconductor device including conductive element | Rainer Steiner, Werner Robl, Markus Brunnbauer, Gottfried Beer | 2011-12-06 |
| 8071428 | Semiconductor device | Markus Brunnbauer, Irmgard Escher-Poeppel, Thorsten Meyer | 2011-12-06 |
| 7993969 | Method for producing a module with components stacked one above another | Michael Bauer | 2011-08-09 |
| 7948071 | Integrated circuit with re-route layer and stacked die assembly | Jochen Thomas, Peter Weitz, Jurgen Grafe, Harry Hedler | 2011-05-24 |
| 7943423 | Reconfigured wafer alignment | Edward Fuergut, Markus Brunnbauer, Thorsten Meyer, Peter Strobel, Daniel Porwol +1 more | 2011-05-17 |
| 7936052 | On-chip RF shields with backside redistribution lines | Hans-Joachim Barth, Gottfried Beer, Heinrich Koerner | 2011-05-03 |
| 7919857 | Plastic housing and semiconductor component with said plastic housing | Michael Bauer, Peter Strobel, Christian Stuempfl, Ludwig Heitzer | 2011-04-05 |
| 7863088 | Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound | Markus Brunnbauer, Rainer Steiner | 2011-01-04 |