Issued Patents 2011
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072084 | Integrated circuit, circuit system, and method of manufacturing | Roland Irsigler, Stephan Dobritz | 2011-12-06 |
| 8049310 | Semiconductor device with an interconnect element and method for manufacture | Andreas Wolter, Roland Irsigler | 2011-11-01 |
| 8048479 | Method for placing material onto a target board by means of a transfer board | Roland Irsigler, Volker Lehmann | 2011-11-01 |
| 8035220 | Semiconductor packaging device | Sven Rzepka | 2011-10-11 |
| 8012807 | Method for producing chip packages, and chip package produced in this way | Thorsten Meyer, Markus Brunnbauer | 2011-09-06 |
| 8004072 | Packaging systems and methods | Juergen Grafe, Steffen Kroehnert | 2011-08-23 |
| 7960843 | Chip arrangement and method of manufacturing a chip arrangement | Roland Irsigler | 2011-06-14 |
| 7948071 | Integrated circuit with re-route layer and stacked die assembly | Jochen Thomas, Peter Weitz, Jurgen Grafe, Jens Pohl | 2011-05-24 |
| 7928590 | Integrated circuit package with a heat dissipation device | Andreas Wolter, Matthias Georgi | 2011-04-19 |
| 7919868 | Carrier substrate and integrated circuit | Thorsten Meyer | 2011-04-05 |
| 7911068 | Component and method for producing a component | Thorsten Meyer, Markus Brunnbauer | 2011-03-22 |
| 7884488 | Semiconductor component with improved contact pad and method for forming the same | — | 2011-02-08 |
| 7867817 | Method for manufacturing a wafer level package | Stephan Dobritz, Henning Mieth | 2011-01-11 |