HM

Henning Mieth

QA Qimonda Ag: 1 patents #84 of 244Top 35%
📍 Thalheim/Erzgebirge, DE: #1 of 3 inventorsTop 35%
Overall (2011): #288,891 of 364,097Top 80%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7867817 Method for manufacturing a wafer level package Stephan Dobritz, Harry Hedler 2011-01-11