Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072084 | Integrated circuit, circuit system, and method of manufacturing | Roland Irsigler, Harry Hedler | 2011-12-06 |
| 7867817 | Method for manufacturing a wafer level package | Harry Hedler, Henning Mieth | 2011-01-11 |