Issued Patents 2011
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080880 | Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads | Jens Pohl, Thorsten Meyer | 2011-12-20 |
| 8076784 | Stacked semiconductor chips | Recai Sezi, Thorsten Meyer, Gottfried Beer | 2011-12-13 |
| 8072071 | Semiconductor device including conductive element | Rainer Steiner, Jens Pohl, Werner Robl, Gottfried Beer | 2011-12-06 |
| 8071428 | Semiconductor device | Jens Pohl, Irmgard Escher-Poeppel, Thorsten Meyer | 2011-12-06 |
| 8063469 | On-chip radio frequency shield with interconnect metallization | Hans-Joachim Barth, Heinrich Koerner, Thorsten Meyer | 2011-11-22 |
| 8012807 | Method for producing chip packages, and chip package produced in this way | Thorsten Meyer, Harry Hedler | 2011-09-06 |
| 7952188 | Semiconductor module with a dielectric layer including a fluorocarbon compound on a chip | Joachim Mahler, Manfred Mengel | 2011-05-31 |
| 7943423 | Reconfigured wafer alignment | Jens Pohl, Edward Fuergut, Thorsten Meyer, Peter Strobel, Daniel Porwol +1 more | 2011-05-17 |
| 7915089 | Encapsulation method | Edward Fuergut, Irmgard Escher-Poeppel | 2011-03-29 |
| 7911068 | Component and method for producing a component | Thorsten Meyer, Harry Hedler | 2011-03-22 |
| 7906860 | Semiconductor device | Thorsten Meyer, Marcus Kastner, Stephan Bradl | 2011-03-15 |
| 7867878 | Stacked semiconductor chips | Recai Sezi, Thorsten Meyer, Gottfried Beer | 2011-01-11 |
| 7863088 | Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound | Jens Pohl, Rainer Steiner | 2011-01-04 |