Issued Patents 2011
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8062928 | Semiconductor device having a semiconductor chip, and method for the production thereof | Michael Bauer | 2011-11-22 |
| 7994646 | Semiconductor device | Joachim Mahler, Manfred Mengel, Ivan Nikitin | 2011-08-09 |
| 7968378 | Electronic device | Joachim Mahler, Louis Vervoort | 2011-06-28 |
| 7943423 | Reconfigured wafer alignment | Jens Pohl, Markus Brunnbauer, Thorsten Meyer, Peter Strobel, Daniel Porwol +1 more | 2011-05-17 |
| 7944061 | Semiconductor device having through contacts through a plastic housing composition and method for the production thereof | Michael Bauer, Thomas Bemmerl, Simon Jerebic, Christian Stuempfl, Horst Theuss +1 more | 2011-05-17 |
| 7935622 | Support with solder ball elements and a method for populating substrates with solder balls | Michael Bauer, Thomas Bemmerl, Simon Jerebic, Herman Vilsmeier | 2011-05-03 |
| 7932180 | Manufacturing a semiconductor device via etching a semiconductor chip to a first layer | Joachim Mahler | 2011-04-26 |
| 7923350 | Method of manufacturing a semiconductor device including etching to etch stop regions | Joachim Mahler, Werner Kroeninger | 2011-04-12 |
| 7915089 | Encapsulation method | Irmgard Escher-Poeppel, Markus Brunnbauer | 2011-03-29 |
| 7893532 | External contact material for external contacts of a semiconductor device and method of making the same | Michael Bauer, Irmgard Escher-Poeppel, Simon Jerebic, Bernd Rakow, Peter Strobel +1 more | 2011-02-22 |
| 7883993 | Semiconductor device with semiconductor chip and rewiring layer and method for producing the same | Hermann Vilsmeier, Holger Woerner | 2011-02-08 |