Issued Patents 2011
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076003 | Coating composition and a method of coating | Manfred Mengel | 2011-12-13 |
| 8039971 | Electronic circuit arrangement | Khalil Hosseini | 2011-10-18 |
| 8030744 | Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same | Thomas Laska, Matthias Stecher, Gregory Bellynck, Khalil Hosseini | 2011-10-04 |
| 8017438 | Semiconductor module with at least two substrates | Michael Bauer, Angela Kessler, Wolfgang Schober, Alfred Haimerl | 2011-09-13 |
| 8013441 | Power semiconductor device in lead frame employing connecting element with conductive film | Michael Bauer, Alfred Haimerl, Angela Kessler, Wolfgang Schober | 2011-09-06 |
| 7994646 | Semiconductor device | Edward Fuergut, Manfred Mengel, Ivan Nikitin | 2011-08-09 |
| 7989930 | Semiconductor package | Edmund Riedl, Johannes Lodermeyer, Mathias Vaupel, Steffen Jordan | 2011-08-02 |
| 7982292 | Semiconductor device | Manfred Mengel | 2011-07-19 |
| 7982309 | Integrated circuit including gas phase deposited packaging material | Louis Vervoort | 2011-07-19 |
| 7968378 | Electronic device | Edward Fuergut, Louis Vervoort | 2011-06-28 |
| 7956446 | Semiconductor device and method | Alexander Heinrich, Klaus Schiess | 2011-06-07 |
| 7955901 | Method for producing a power semiconductor module comprising surface-mountable flat external contacts | Henrik Ewe, Stefan Landau, Klaus Schiess, Robert Bergmann, Alvin Wee Beng Tatt +3 more | 2011-06-07 |
| 7955954 | Method of making semiconductor devices employing first and second carriers | Stefan Landau, Thomas Wowra | 2011-06-07 |
| 7952188 | Semiconductor module with a dielectric layer including a fluorocarbon compound on a chip | Markus Brunnbauer, Manfred Mengel | 2011-05-31 |
| 7932180 | Manufacturing a semiconductor device via etching a semiconductor chip to a first layer | Edward Fuergut | 2011-04-26 |
| 7923823 | Semiconductor device with parylene coating | Manfred Mengel | 2011-04-12 |
| 7923350 | Method of manufacturing a semiconductor device including etching to etch stop regions | Edward Fuergut, Werner Kroeninger | 2011-04-12 |
| 7911039 | Component arrangement comprising a carrier | Michael Bauer, Alfred Haimerl, Angela Kessler, Wolfgang Schober | 2011-03-22 |
| 7880300 | Semiconductor chip comprising a metal coating structure and associated production method | Michael Bauer, Alfred Haimerl, Angela Kessler, Wolfgang Schober | 2011-02-01 |
| 7880285 | Semiconductor device comprising a semiconductor chip stack and method for producing the same | Khalil Hosseini | 2011-02-01 |
| 7874475 | Method for the planar joining of components of semiconductor devices and a diffusion joining structure | Khalil Hosseini, Edmund Riedl, Ivan Galesic, Konrad Roesl | 2011-01-25 |
| 7868465 | Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier | Ralf Otremba, Bernd Rakow, Reimund Engl, Rupert Fischer | 2011-01-11 |