SL

Stefan Landau

Infineon Technologies Ag: 2 patents #152 of 900Top 20%
QA Qimonda Ag: 1 patents #84 of 244Top 35%
📍 Usingen, DE: #1 of 15 inventorsTop 7%
Overall (2011): #35,379 of 364,097Top 10%
3
Patents 2011

Issued Patents 2011

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
7955901 Method for producing a power semiconductor module comprising surface-mountable flat external contacts Henrik Ewe, Klaus Schiess, Robert Bergmann, Alvin Wee Beng Tatt, Soon Lock Goh +3 more 2011-06-07
7955954 Method of making semiconductor devices employing first and second carriers Joachim Mahler, Thomas Wowra 2011-06-07
7872350 Multi-chip module Ralf Otremba, Josef Hoeglauer, Erwin Huber 2011-01-18