Issued Patents 2011
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8062928 | Semiconductor device having a semiconductor chip, and method for the production thereof | Edward Fuergut | 2011-11-22 |
| 8017438 | Semiconductor module with at least two substrates | Angela Kessler, Wolfgang Schober, Alfred Haimerl, Joachim Mahler | 2011-09-13 |
| 8013441 | Power semiconductor device in lead frame employing connecting element with conductive film | Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2011-09-06 |
| 8011495 | Transfer device metering apparatus and methods | Vernon J. Anderson, Gene Allen Corle, Christopher T. Davis, Simin Jiang, Irvan Leo Pazdernik +1 more | 2011-09-06 |
| 7993969 | Method for producing a module with components stacked one above another | Jens Pohl | 2011-08-09 |
| 7944061 | Semiconductor device having through contacts through a plastic housing composition and method for the production thereof | Thomas Bemmerl, Edward Fuergut, Simon Jerebic, Christian Stuempfl, Horst Theuss +1 more | 2011-05-17 |
| 7935622 | Support with solder ball elements and a method for populating substrates with solder balls | Thomas Bemmerl, Edward Fuergut, Simon Jerebic, Herman Vilsmeier | 2011-05-03 |
| 7919857 | Plastic housing and semiconductor component with said plastic housing | Peter Strobel, Jens Pohl, Christian Stuempfl, Ludwig Heitzer | 2011-04-05 |
| 7911039 | Component arrangement comprising a carrier | Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2011-03-22 |
| 7893532 | External contact material for external contacts of a semiconductor device and method of making the same | Irmgard Escher-Poeppel, Edward Fuergut, Simon Jerebic, Bernd Rakow, Peter Strobel +1 more | 2011-02-22 |
| 7880300 | Semiconductor chip comprising a metal coating structure and associated production method | Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2011-02-01 |