Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072085 | Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same | Wolfgang Hetzel | 2011-12-06 |
| 7948071 | Integrated circuit with re-route layer and stacked die assembly | Peter Weitz, Jurgen Grafe, Harry Hedler, Jens Pohl | 2011-05-24 |