WH

Wolfgang Hetzel

QA Qimonda Ag: 1 patents #84 of 244Top 35%
📍 Nattheim, DE: #1 of 2 inventorsTop 50%
Overall (2011): #129,215 of 364,097Top 40%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8072085 Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same Jochen Thomas 2011-12-06