Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8075152 | Hermetic light-emitting device | Yao-Shun Chen | 2011-12-13 |
| 8049330 | Wafer-level chip scale packaging for LED comprising carrier substrate with thermally conductive through holes and fill channels | Wei-Chung Lo, Li Shen | 2011-11-01 |
| 8026603 | Interconnect structure of an integrated circuit and manufacturing method thereof | Yung-Yu Hsu, Chih-Yuan Cheng, Shyi-Ching Liau, Min-Lin Lee, Rong-Chang Feng | 2011-09-27 |
| 8004079 | Chip package structure and manufacturing method thereof | Yu-Lin Chao, Shu-Jung Yang, Rong-Chang Fang, Wei Li, Chih-Yuan Cheng +1 more | 2011-08-23 |
| 7952368 | Apparatus and method for measuring diode chip | Ming-Ji Dai, Sheng-Liang Li, Chun-Kai Liu, Chung-Yen Hsu, Ming-Te Lin +1 more | 2011-05-31 |
| 7948072 | Wafer-to-wafer stacking | Shu-Ming Chang, Shyi-Ching Liau, Wei-Chung Lo, Rong-Shen Lee, Chi-Shih Chang | 2011-05-24 |