Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8049330 | Wafer-level chip scale packaging for LED comprising carrier substrate with thermally conductive through holes and fill channels | Ra-Min Tain, Wei-Chung Lo | 2011-11-01 |
| 7973399 | Embedded chip package | — | 2011-07-05 |