Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8049330 | Wafer-level chip scale packaging for LED comprising carrier substrate with thermally conductive through holes and fill channels | Ra-Min Tain, Li Shen | 2011-11-01 |
| 8039935 | Wafer level chip scale packaging structure and method of fabricating the same | Shu-Ming Chang, Lee-Cheng Shen | 2011-10-18 |
| 7948072 | Wafer-to-wafer stacking | Ra-Min Tain, Shu-Ming Chang, Shyi-Ching Liau, Rong-Shen Lee, Chi-Shih Chang | 2011-05-24 |