Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039935 | Wafer level chip scale packaging structure and method of fabricating the same | Lee-Cheng Shen, Wei-Chung Lo | 2011-10-18 |
| 8034025 | Disposable safety syringe | — | 2011-10-11 |
| 8035608 | Inverter circuit of driving a lamp and backlight module using the same | Shwang-Shi Bai, I-Sheng Lin, Hsiu-Na Hsieh | 2011-10-11 |
| 7988808 | Bonding structure with buffer layer and method of forming the same | Su-Tsai Lu, Shyh-Ming Chang, Yao-Sheng Lin, Yuan-Chang Huang | 2011-08-02 |
| 7960773 | Capacitor device and method for manufacturing the same | Chia-Wen Chiang | 2011-06-14 |
| 7955300 | Disposable safety syringe with retractable needle | — | 2011-06-07 |
| 7948072 | Wafer-to-wafer stacking | Ra-Min Tain, Shyi-Ching Liau, Wei-Chung Lo, Rong-Shen Lee, Chi-Shih Chang | 2011-05-24 |
| 7902674 | Three-dimensional die-stacking package structure | Hsiang-Hung Chang | 2011-03-08 |