Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026603 | Interconnect structure of an integrated circuit and manufacturing method thereof | Yung-Yu Hsu, Chih-Yuan Cheng, Min-Lin Lee, Ra-Min Tain, Rong-Chang Feng | 2011-09-27 |
| 7948072 | Wafer-to-wafer stacking | Ra-Min Tain, Shu-Ming Chang, Wei-Chung Lo, Rong-Shen Lee, Chi-Shih Chang | 2011-05-24 |