Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7988808 | Bonding structure with buffer layer and method of forming the same | Su-Tsai Lu, Shu-Ming Chang, Yao-Sheng Lin, Yuan-Chang Huang | 2011-08-02 |
| 7977788 | Contact structure having a compliant bump and a testing area | Sheng-Shu Yang, Chao-Chyun An | 2011-07-12 |
| 7871918 | Manufacturing method of contact structure | — | 2011-01-18 |