Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8004079 | Chip package structure and manufacturing method thereof | Ra-Min Tain, Yu-Lin Chao, Shu-Jung Yang, Wei Li, Chih-Yuan Cheng +1 more | 2011-08-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8004079 | Chip package structure and manufacturing method thereof | Ra-Min Tain, Yu-Lin Chao, Shu-Jung Yang, Wei Li, Chih-Yuan Cheng +1 more | 2011-08-23 |