Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8027746 | Atomic layer deposition apparatus | Alfred Mak, Lawrence Chung-Lai Lei, Ming Xi, Hua Chung, Ken Kaung Lai +1 more | 2011-09-27 |
| 7989343 | Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more | 2011-08-02 |
| 7892602 | Cyclical deposition of refractory metal silicon nitride | Hua Chung, Ling Chen | 2011-02-22 |