Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989343 | Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features | Tony P. Chiang, Gongda Yao, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2011-08-02 |
| 7884032 | Thin film deposition | Mengqi Ye, Hougong Wang, Zhendong Liu | 2011-02-08 |