Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8062982 | High yield plasma etch process for interlayer dielectrics | Daniel Fischer, Matthias Lehr, Kornelia Dittmar | 2011-11-22 |
| 7986040 | Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices | Christin Bartsch, Daniel Fischer | 2011-07-26 |
| 7883629 | Technique for patterning differently stressed layers formed above transistors by enhanced etch control strategies | Heike Salz, Ralf Richter, Sylvio Mattick | 2011-02-08 |