Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8062982 | High yield plasma etch process for interlayer dielectrics | Matthias Schaller, Matthias Lehr, Kornelia Dittmar | 2011-11-22 |
| 7986040 | Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices | Christin Bartsch, Matthias Schaller | 2011-07-26 |