Issued Patents 2005
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6975516 | Component built-in module and method for producing the same | Toshiyuki Asahi, Yasuhiro Sugaya, Shingo Komatsu, Yoshiyuki Yamamoto | 2005-12-13 |
| 6958535 | Thermal conductive substrate and semiconductor module using the same | Koichi Hirano, Yoshihisa Yamashita | 2005-10-25 |
| 6955948 | Method of manufacturing a component built-in module | Toshiyuki Asahi, Yasuhiro Sugaya, Shingo Komatsu | 2005-10-18 |
| 6939738 | Component built-in module and method for producing the same | Yasuhiro Sugaya, Toshiyuki Asahi, Shingo Komatsu | 2005-09-06 |
| 6936774 | Wiring substrate produced by transfer material method | Yasuhiro Sugaya, Shingo Komatsu, Koichi Hirano, Yasuyuki Matsuoka, Toshiyuki Asahi +1 more | 2005-08-30 |
| 6931725 | Circuit component built-in module, radio device having the same, and method for producing the same | Yasuhiro Sugaya, Koichi Hirano, Yasuyuki Matsuoka, Satoru Yuuhaku, Toshiyuki Asahi | 2005-08-23 |
| 6871396 | Transfer material for wiring substrate | Yasuhiro Sugaya, Shingo Komatsu, Koichi Hirano, Yasuyuki Matsuoka, Toshiyuki Asahi +1 more | 2005-03-29 |
| 6870244 | Lead frame and production process thereof and production process of thermally conductive substrate | Yoshihisa Yamashita, Koichi Hirano, Masaki Suzumura | 2005-03-22 |
| 6863962 | Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same | Hiroyuki Handa | 2005-03-08 |
| 6860004 | Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink | Koichi Hirano, Mitsuhiro Matsuo, Yoshihisa Yamashita | 2005-03-01 |
| 6855892 | Insulation sheet, multi-layer wiring substrate and production processes thereof | Shingo Komatsu, Yasuhiro Sugaya, Toshiyuki Asahi, Yoshiyuki Yamamoto | 2005-02-15 |