Issued Patents 2005
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6964700 | Ink for use in ink jet recording and ink jet recording method utilizing the same | Ayako Uji, Noribumi Koitabashi, Ryota Kato, Takeshi Miyazaki, Yasunori Fujimoto | 2005-11-15 |
| 6958535 | Thermal conductive substrate and semiconductor module using the same | Koichi Hirano, Seiichi Nakatani | 2005-10-25 |
| 6936774 | Wiring substrate produced by transfer material method | Yasuhiro Sugaya, Shingo Komatsu, Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka +1 more | 2005-08-30 |
| 6930395 | Circuit substrate having improved connection reliability and a method for manufacturing the same | Satoru Tomekawa, Takeshi Suzuki, Yoshihiro Kawakita, Tadashi Nakamura | 2005-08-16 |
| 6921433 | Aqueous dispersion of water-insoluble-colorant-containing particle and preparation process thereof, water-insoluble-colorant-containing particle and preparation process thereof, and ink | Hideto Kuribayashi, Akio Kashiwazaki, Masashi Hirose, Takeshi Miyazaki | 2005-07-26 |
| 6871396 | Transfer material for wiring substrate | Yasuhiro Sugaya, Shingo Komatsu, Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka +1 more | 2005-03-29 |
| 6870244 | Lead frame and production process thereof and production process of thermally conductive substrate | Koichi Hirano, Seiichi Nakatani, Masaki Suzumura | 2005-03-22 |
| 6860004 | Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink | Koichi Hirano, Seiichi Nakatani, Mitsuhiro Matsuo | 2005-03-01 |