Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6958535 | Thermal conductive substrate and semiconductor module using the same | Yoshihisa Yamashita, Seiichi Nakatani | 2005-10-25 |
| 6936774 | Wiring substrate produced by transfer material method | Yasuhiro Sugaya, Shingo Komatsu, Seiichi Nakatani, Yasuyuki Matsuoka, Toshiyuki Asahi +1 more | 2005-08-30 |
| 6931725 | Circuit component built-in module, radio device having the same, and method for producing the same | Yasuhiro Sugaya, Seiichi Nakatani, Yasuyuki Matsuoka, Satoru Yuuhaku, Toshiyuki Asahi | 2005-08-23 |
| 6871396 | Transfer material for wiring substrate | Yasuhiro Sugaya, Shingo Komatsu, Seiichi Nakatani, Yasuyuki Matsuoka, Toshiyuki Asahi +1 more | 2005-03-29 |
| 6870244 | Lead frame and production process thereof and production process of thermally conductive substrate | Yoshihisa Yamashita, Seiichi Nakatani, Masaki Suzumura | 2005-03-22 |
| 6860004 | Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink | Seiichi Nakatani, Mitsuhiro Matsuo, Yoshihisa Yamashita | 2005-03-01 |