Issued Patents 2005
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6975516 | Component built-in module and method for producing the same | Yasuhiro Sugaya, Shingo Komatsu, Yoshiyuki Yamamoto, Seiichi Nakatani | 2005-12-13 |
| 6955948 | Method of manufacturing a component built-in module | Yasuhiro Sugaya, Shingo Komatsu, Seiichi Nakatani | 2005-10-18 |
| 6939738 | Component built-in module and method for producing the same | Seiichi Nakatani, Yasuhiro Sugaya, Shingo Komatsu | 2005-09-06 |
| 6936774 | Wiring substrate produced by transfer material method | Yasuhiro Sugaya, Shingo Komatsu, Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka +1 more | 2005-08-30 |
| 6931725 | Circuit component built-in module, radio device having the same, and method for producing the same | Yasuhiro Sugaya, Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka, Satoru Yuuhaku | 2005-08-23 |
| 6885788 | Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling member of the module | Hideki Iwaki, Yutaka Taguchi, Tetsuyoshi Ogura, Yasuhiro Sugaya, Tousaku Nishiyama +1 more | 2005-04-26 |
| 6871396 | Transfer material for wiring substrate | Yasuhiro Sugaya, Shingo Komatsu, Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka +1 more | 2005-03-29 |
| 6855892 | Insulation sheet, multi-layer wiring substrate and production processes thereof | Shingo Komatsu, Seiichi Nakatani, Yasuhiro Sugaya, Yoshiyuki Yamamoto | 2005-02-15 |