Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6975516 | Component built-in module and method for producing the same | Toshiyuki Asahi, Yasuhiro Sugaya, Yoshiyuki Yamamoto, Seiichi Nakatani | 2005-12-13 |
| 6955948 | Method of manufacturing a component built-in module | Toshiyuki Asahi, Yasuhiro Sugaya, Seiichi Nakatani | 2005-10-18 |
| 6939738 | Component built-in module and method for producing the same | Seiichi Nakatani, Yasuhiro Sugaya, Toshiyuki Asahi | 2005-09-06 |
| 6936774 | Wiring substrate produced by transfer material method | Yasuhiro Sugaya, Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka, Toshiyuki Asahi +1 more | 2005-08-30 |
| 6871396 | Transfer material for wiring substrate | Yasuhiro Sugaya, Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka, Toshiyuki Asahi +1 more | 2005-03-29 |
| 6855892 | Insulation sheet, multi-layer wiring substrate and production processes thereof | Seiichi Nakatani, Yasuhiro Sugaya, Toshiyuki Asahi, Yoshiyuki Yamamoto | 2005-02-15 |