Issued Patents 2005
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6980438 | Semiconductor package with heat dissipating structure | Han-Ping Pu, Chin-Te Chen, Chang-Fu Lin | 2005-12-27 |
| 6972216 | Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same | Chih-Ming Huang | 2005-12-06 |
| 6943439 | Substrate and fabrication method of the same | Han-Ping Pu, Chih-Chin Liao | 2005-09-13 |
| 6891273 | Semiconductor package and fabrication method thereof | Han-Ping Pu | 2005-05-10 |
| 6884652 | Semiconductor package free of substrate and fabrication method thereof | Yu-Po Wang, Chih-Ming Huang | 2005-04-26 |
| 6870274 | Flash-preventing window ball grid array semiconductor package, method for fabricating the same, and chip carrier used in the semiconductor package | — | 2005-03-22 |
| 6867487 | Flash-preventing semiconductor package | Tzong-Da Ho | 2005-03-15 |
| 6858931 | Heat sink with collapse structure for semiconductor package | Chi-Chuan Wu, Jui-Yu Chuang, Lien-Chi Chan | 2005-02-22 |
| 6856015 | Semiconductor package with heat sink | Cheng-Hsu Hsiao, Shih-Kuang Chiu | 2005-02-15 |
| 6849942 | Semiconductor package with heat sink attached to substrate | Chang-Fu Lin, Han-Ping Pu, Cheng-Hsu Hsiao | 2005-02-01 |
| 6847104 | Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same | Chih-Ming Huang, Jui-Yu Chuang, Lien-Chi Chan | 2005-01-25 |
| 6844622 | Semiconductor package with heat sink | Tzong-Da Ho, Cheng-Hsu Hsiao | 2005-01-18 |