Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6858931 | Heat sink with collapse structure for semiconductor package | Chien-Ping Huang, Chi-Chuan Wu, Lien-Chi Chan | 2005-02-22 |
| 6847104 | Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same | Chien-Ping Huang, Chih-Ming Huang, Lien-Chi Chan | 2005-01-25 |