Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6951776 | Method of fabricating a thin and fine ball-grid array package with embedded heat spreader | Randy H. Y. Lo | 2005-10-04 |
| 6949413 | Method of fabricating a thin and fine ball-grid array package with embedded heat spreader | Randy H. Y. Lo | 2005-09-27 |
| 6949414 | Method of fabricating a thin and fine ball-grid array package with embedded heat spreader | Randy H. Y. Lo | 2005-09-27 |
| 6933175 | Method of fabricating a thin and fine ball-grid array package with embedded heat spreader | Randy H. Y. Lo | 2005-08-23 |
| 6858931 | Heat sink with collapse structure for semiconductor package | Chien-Ping Huang, Jui-Yu Chuang, Lien-Chi Chan | 2005-02-22 |