Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6980438 | Semiconductor package with heat dissipating structure | Chien-Ping Huang, Han-Ping Pu, Chin-Te Chen | 2005-12-27 |
| 6849942 | Semiconductor package with heat sink attached to substrate | Han-Ping Pu, Cheng-Hsu Hsiao, Chien-Ping Huang | 2005-02-01 |