Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6980438 | Semiconductor package with heat dissipating structure | Chien-Ping Huang, Chin-Te Chen, Chang-Fu Lin | 2005-12-27 |
| 6943439 | Substrate and fabrication method of the same | Chien-Ping Huang, Chih-Chin Liao | 2005-09-13 |
| 6891273 | Semiconductor package and fabrication method thereof | Chien-Ping Huang | 2005-05-10 |
| 6849942 | Semiconductor package with heat sink attached to substrate | Chang-Fu Lin, Cheng-Hsu Hsiao, Chien-Ping Huang | 2005-02-01 |